Future Optics SWDM z-block is a passive optical subassembly (POSA) based on our free-space-optics wavelength division multiplexing (WDM) platform to deliver optical mux / demux functionality directly inside standard or customized small-form-factor transceivers. Our unique filter based ROSA block and TOSA block are designed to seamlessly integrate with your specific input and output interface.. Future Optics Z-block subassemblies are available for various channel center wavelength SWDM4 transceivers and with custom beam pitch designs.
Future Optics’ 851nm-941nm SWDM Z-BLOCK mux / demux is a very compact TFF optical sub-assembly device acting as an optical engine to combine or to separate channels for high-speed transceivers in data centers and optical communication networks.
Based on thin film filter technology and optical path Zig-Zag design of micro-optics, taking advantage of high precision assembly, this product features small form, ultra-low loss, high channel isolation and exceptional stability in comparison with AWG WDM mux demux device based on silicon chip technology.
The very high parallelism pitch tolerance of Future Optics’ Z-blocks enables a rapid alignment process during coupling and assembly.
Future Optics provide all kinds of SWDM Z-BLOCK mux demux devices with various channel numbers, beam pitches and angle of incidence for customers to choose.
Features
Low insertion loss
High beams parallelism
Exceptional reliability and stability
Telcordia GR-1221/1209-Core Compliant
Applications：
MUX/DEMUX for 100G/400G /800G transceivers and other high speed transceivers in Datacom/Telecom
Specifications：
Parameter | Unit | Specifications |
Operation wavelength | nm | 840 ~ 960 |
Center wavelength(λc) | nm | 851/881/ 911/941 |
Passband(PB) | nm | λc ±8 |
Max. Insertion loss @PB | dB | <1.0 |
IL uniformity @PB | dB | <0.4 |
PDL@passband | dB | <0.25 |
Adjacent CH crosstalk@PB | dB | >25 |
Non-Adj. CH XT@PB | dB | >30 |
Typical A.O.I(in air) | Deg. | 8/13.5, etc. |
Pitch | um | 500/750/900/1000/1100/1500, etc. |
Typical beam parallelism | Deg. | <0.2 |
Edge chip | mm | <0.1 |
Corner chip | mm | <0.2 |
Surface quality | - | 40/20 |
Operation temperature | °C | -20 ~ +85 |
Storage temperature | °C | -40 ~ +85 |
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